The new Everest chip solution from Celeno, targeting companies interested in moving to the latest 802.11 standard, includes new features including uplink/downlink MU-OFDMA and MU-MIMO, high order 1024 QAM modulation, and trigger-based scheduling.
Available in a 12×12 BGA package, Everest, with its PCIe-based interface, uses 14nm FinFET node technology, and utilizes Celeno’s own AX.L subsystem to produce link rates up to 4.8 Gbps, as well as supporting 2.4 and 5 GHz bands.
Details on pricing, availability, or samples were not announced.Celeno will have a hospitality suite at CES 2018 in Las Vegas.